英文学术会议邀请函

　　篇一：英语会议邀请函模板

　　Dear XX,

　　On behalf of the XXXXX, I would be very pleased to invite you to attend a conference of the forthcoming 1st Opportunity and Challenge XXXXX to be held in XXXUniversity, China, from December 19 to December 30, 2011.

　　As we all know, Google is one of the top corporations around the world in Computer Science, and the biggest Internet search service provider. At the same time, Google’s products are also famous and popular in Music, Society Network, and Smartphone Operating System et al. You are an internationally acclaimed scholar and businessman assuredly. Your research on distributed software service and parallel computation is widely used in Computer Science. Your participation will be among the highlights of the conference.

　　We sincerely hope that you could accept our invitation. As you know, this is the 1st held of OCCSG and we plan to make it a truly international meeting. We have accepted many papers from several disciplines.

　　If you can come, please let us know as soon as possible, since we

　　have to prepare the final program soon. We are looking forward to your acceptance.

　　Sincerely yours,

　　XXXX

　　XXXXXXX

　　篇二：学术会议邀请函 An invitation letter

　　Dear Ms Wang:

　　I have the great pleasure, on behalf of the International Conference on Medical Biometrics organization, of inviting you to contribute to the symposium on Medical device technologies, Medical data processing and management, Medical Pattern Recognition, Medical biometric systems and applications to be held in Shenzhen, between 30th May and 1th June 201*.

　　We would like to invite you to submit a manuscript to the International Conference on Medical imaging devices, Medical information retrieval, Biometric technologies, Feature matching and classification, Computer-aided diagnosis and Other applications. The idea is to present originally contributed research, review, and short communication articles in the field of Medical Biometrics. Deadline for submissions would be April 3, 201*. Kindly submit your manuscripts as an E-mail attachment at luguangm@hit.edu.cn.

　　I will be looking forward to your favorable reply.

　　Sincerely yours,

　　Guangming Lu

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